发明名称 FILM-FORMING APPARATUS HAVING SUBSTRATE-ROTATING MECHANISM
摘要 PROBLEM TO BE SOLVED: To provide a film-forming apparatus having a substrate-rotating mechanism wherein by a substrate rotating and revolving mechanism, the adjustment of the revolving axis of its susceptor is made comparably easy as to make its maintainability proper, and by preventing foreign matters from sticking on substrates and by subjecting the temperatures of its susceptor and the peripheral portions of the substrates to desired temperature-distributions, films having desired qualities and desired thicknesses can be formed. SOLUTION: In the film-forming apparatus, a circular-disk form susceptor 30 is held revolvably by a base plate 6 to drive its outer periphery and revolve it by revolution generating portions 5. Concurrently, ring-form substrate-trays 20 are held rotatably by a plurality of substrate-tray holding portions 23 provided in the susceptor 30 and are rotated by a rotation generating portion 4, to subject a plurality of substrates W to film-forming processes, while rotating and revolving the plurality of substrates W held by the substrate trays 20. In this way, the film-forming apparatus is configured to cause the substrates W rotate and revolve by one or more revolution generating portions 5 and by the rotation generating portion 4.
申请公布号 JP2002175992(A) 申请公布日期 2002.06.21
申请号 JP20000373278 申请日期 2000.12.07
申请人 EE TECHNOLOGIES:KK 发明人 KOMENO JUNJI;SHIINA KAZUNARI
分类号 C23C16/44;C23C16/458;C30B25/12;H01L21/205;H01L21/28;H01L21/285;H01L21/302;H01L21/3065;H01L21/687;(IPC1-7):H01L21/205;H01L21/306 主分类号 C23C16/44
代理机构 代理人
主权项
地址