APPARATUS FOR CLEANING EDGE PORTION OF SUBSTRATE

摘要

PURPOSE: A cleaning apparatus is provided to prevent a physical damage due to contacts and a recontamination due to a contaminated cleaning solution by improving a structure and using a dry ice instead of the cleaning solution. CONSTITUTION: A cleaning apparatus comprises a nozzle part(1) for spraying a solid body made of CO2, such as a dry ice, and a nozzle moving part(2) for moving the nozzle part(1) from/to a cleaning position to/from a stand-by position. The nozzle part(1) further includes a wafer accommodating part(3) having a first nozzle installed in the wafer accommodating part(3) for spraying CO2 particles at the edge portions of a wafer, a second nozzle installed on the upper part of the wafer accommodating part(3) for spraying the CO2 particles to the upper surface of the wafer, and a third nozzle installed on the lower part of the wafer accommodating part(3) for cleaning the rear surface of the wafer.