| 摘要 |
<p>PURPOSE: A chip scale package is provided to improve a bonding reliability by connecting a bonding pad of a semiconductor chip with a circuit pattern of a circuit layer. CONSTITUTION: A chip scale package comprises a chip(1) having bonding pads(2), a circuit layer formed with windows on the positions of the bonding pads(2), interconnection metals(9a) filled into the windows for electrically connecting the bonding pads(2) as the outer connecting pads of the chip(1) with the circuit pattern of the circuit layer, thereby improving a bonding reliability, an EMC(Epoxy Molding Compound)(7) covering both sides of the chip(1) and leads, and solder balls(8) sticking to the opposite side of the chip fixed surface of the circuit layer.</p> |
