HEAT SINK, MANUFACTURING METHOD THEREOF, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PROBLEM TO BE SOLVED: To provide a heat sink on which a heat-resistive mark can be easily and efficiently made and that hardly causes the height variation. SOLUTION: The heat sink 2 for dissipating heat generated in a semiconductor element 5 is disposed near the semiconductor element 5 in a semiconductor package 1. It has a mark 9 formed at a specified portion of a copper or copper alloy metal plate 10 by a black oxidation process as an index for mounting the semiconductor package 1 on a substrate.