SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: To provide a semiconductor device that is mounted with high density three dimensionally without employing a high-priced substrate nor high manufacturing techniques. CONSTITUTION: This semiconductor device is provided with a substrate that is made of resin materials, a semiconductor element that is mounted in the predetermined position of the substrate, and an external connecting terminal that is electrically connected to the semiconductor element. The semiconductor element and the external connecting terminal are embedded into the substrate and are electrically connected with each other via a wire. The back face of the semiconductor element and the terminal plane of the external connecting terminal are exposed on the same plane of the substrate.