发明名称 METHOD FOR CHARACTERISTIC CONTROL OF WAFER FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method for accurately changing the electric characteristics of a semiconductor wafer for manufacturing a hetero structure modulation doped field effect transistor to a value within a desired range while confirming that the sagging of the boundary of an epitaxial layer and the spread of impurities, etc., are not deteriorated by a nondestructive method. SOLUTION: A laminated body composed by laminating a buffer layer 2, a channel layer 3, a barrier layer 4 having an Si delta doped carrier supply layer 5 composed by doping Si in a delta function shape, an etching stopper layer 6, an intermediate layer 7 for contact, a lower contact layer 8 and an upper contact layer 9 on a substrate 1 in the order as an epitaxial film is heat- treated. The change of the electric characteristics of the wafer by the heat treatment is recognized by measuring the photoluminescence of the channel layer 3 or the barrier layer 4.
申请公布号 JP2002176170(A) 申请公布日期 2002.06.21
申请号 JP20000372664 申请日期 2000.12.07
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 WATANABE KAZUO;SUGIYAMA HIROKI;SUEMITSU TETSUYA;FUKAI YOSHINO
分类号 H01L21/66;H01L21/338;H01L29/778;H01L29/812;(IPC1-7):H01L29/778 主分类号 H01L21/66
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