METHOD FOR PROCESSING SILICON WAFER

摘要

PROBLEM TO BE SOLVED: To reduce a crack failure of a silicon wafer and to improve its yield by providing a polishing technique for flattening an infinitesimal ruggedness existing on a side face of a silicon block or a silicon stack in a short time. SOLUTION: A method for processing the silicon wafer comprises the step of flattening the infinitesimal ruggedness existing on the side face of the silicon block or the silicon stack for manufacturing a silicon wafer.