| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and device for treating platy substrate by which the occurrence of water stains or water marks that cause device failures, such as the disconnection, short-circuiting, etc., of wiring and lower the manufacturing yield of a liquid crystal substrate or semiconductor substrate can be prevented in the course of drying treatment after the substrate is treated with a fluid. SOLUTION: The water stains formed on the treated substrate can be reduced by passing the substrate through a space isolated from the outside by utilizing the difference in surface tension between the fluid and the substrate and contriving the supplying and sucking positions of the fluid.
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