发明名称 THERMOPLASTIC RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a thermoplastic resin composition comprising as the resin components a polyphenylene ether resin and a polyamide resin, maintaining various properties including high-temperature rigidity, molding processability, molded product appearance and heat resistance at satisfiable levels, having low water-absorbing tendency and such as excellent characteristic as to be small in dimensional change under a highly humid ambience. SOLUTION: This thermoplastic resin composition comprises (A) a polyphenylene ether resin, (B) a polyamide resin and (C) a novolak-type phenolic resin obtained by reaction between a phenolic compound of general formula (I) [wherein, k and (a) are each an integer of 1-5 (in this case, k+a=6); and R1 is a 1-8C alkyl or alkoxy] and an aldehyde; wherein the weight ratio A/B is (5:95) to (90:10) and the content of the component C is 0.2-10 pt(s).wt. based on a total of 100 pts.wt. of the components A and B.
申请公布号 JP2002173595(A) 申请公布日期 2002.06.21
申请号 JP20000369685 申请日期 2000.12.05
申请人 SUMITOMO CHEM CO LTD 发明人 MORITOMI SATORU;SANADA TAKASHI;SHIMANO KOKICHI
分类号 C08L71/12;C08L61/06;C08L77/00;(IPC1-7):C08L71/12 主分类号 C08L71/12
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