COOLING STRUCTURE OF MULTI-CHIP MODULE

摘要

PROBLEM TO BE SOLVED: To cool a multi-chip module effectively and prevent a defect in soldering when solder or brazing material is used in the solder joint. SOLUTION: An electrode plate 30 to be soldered to electronic element chips 2 and 26 with solder is made of material with high thermal conductivity. The electrode plate 30 has projected parts 31a and 31b at positions to be soldered to the electronic element chips 24 and 26. The fitting area of projected parts 31a and 31b to be fitted to the electronic element chips 24 and 26 is smaller than the surface area of the electronic element chips 24 and 26. While heat generated from the electronic element chips 24 and 26 is radiated effectively, extra solder is caused to overflow to the sidewall of the projected parts 31a and 31b during the soldering when the electrode plate 30 is soldered to the electronic element chips 24 and 26, so a defect in soldering can be prevented.