发明名称 PACKAGE FOR STORING SEMICONDUCTOR ELEMENT
摘要 <p>PROBLEM TO BE SOLVED: To have a semiconductor element normally and stably operate for a long period of time by securing reliable continuity through improvement in the tensile strength of a lead wire of a Peltier element and assuring rigid joint between the lead wire of Peltier element and a metallized wiring layer of an input/output terminal. SOLUTION: A connecting portion of the input/output terminal 3 is provided to a flat plate through the upper and lower surface from a metallized wiring layer 11 located at the internal side of a frame 2, a metallized layer is formed at the internal surface of a cut-away portion 3d in which a stepped portion providing a small internal size is formed to the internal side from the opening in the upper surface side, and a lead wire 13 is inserted to the cut-away portion 3d and is brazed thereto for connection.</p>
申请公布号 JP2002176117(A) 申请公布日期 2002.06.21
申请号 JP20000373034 申请日期 2000.12.07
申请人 KYOCERA CORP 发明人 KOISO EMI
分类号 H01L23/02;H01L23/04;(IPC1-7):H01L23/02 主分类号 H01L23/02
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