发明名称 METHOD OF MANUFACTURING PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To improve reliability on connection between the layers of a printed wiring board and enhance the productivity. SOLUTION: A laminate 11 is made by sticking resin sheets 7 fitted with copper foils to both sides of a base board 3 provided with a circuit pattern 2, and a nonthrough hole 8 to the surface of the circuit pattern 2 of an inner layer from the copper foil 6 at the surface of the laminate 11 is made. Furthermore, general purpose conductive paste 9 is screen-printed into the nonthrough hole 8 of the laminate 11 through a relatively inexpensive (mesh) screen board 14 where a paste discharge port 15 with a diameter two times as large as the nonthrough hole 8 is made, and then vacuum heating press is executed in decompressed atmosphere to the laminate 11. As a result, the conductive paste 9 can be filled into the nonthrough hole 8 at large while removing the air involved, for example, in it at paste printing without fail from the nonthrough hole 8, and a printed wiring board 1 where the reliability on electric connection between the circuit pattern 5 (copper foil 6) at the surface and the circuit pattern 2 at the inner layer is enhanced can be manufactured at low cost.
申请公布号 JP2002176258(A) 申请公布日期 2002.06.21
申请号 JP20000374931 申请日期 2000.12.08
申请人 TOSHIBA CHEM CORP 发明人 TANAKA NOBUO
分类号 H05K3/40;H05K3/46;(IPC1-7):H05K3/40 主分类号 H05K3/40
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