SEMI-CONDUCTOR COMPONENT AND METHOD FOR THE PRODUCTION THEREOF

摘要

The invention relates to a semi-conductor component, comprising a semi-conductor chip having contact pads on the first main surface area thereof. A wiring film is applied to the first main surface area, avoiding the contact pads. On the opposite side of the first main side of the semi-conductor chip, said wiring film has a solder stop mask which covers the conductors. Contact pads lying in at least one groove are wired to the adjacent ends of the conductors in order to connect the contact pads to the soldering contacts lying in the grooves of the solder stop mask. Each wire connection and the end of the conductor thereof is enveloped by a casting material. Said solder stop mask comprises at least one depression and one rise, enabling the casting material to be spread in a directed manner when applied to the semi-conductor component.