发明名称 |
MULTI-CHIP SEMICONDUCTOR PACKAGE STRUCTURE |
摘要 |
A multi-chip semiconductor package structure. The structure includes two chips and two lead frames. The leads on one of the lead frames have inner leads at one end and joint sections at the other end. The joint sections are connected with another lead frame. Both lead frames use a common set of external leads. The two chips and two lead frames are joined together forming a lead-on-chip structure with the two chips facing each other back-to-back. The assembly except the external leads is enclosed by packaging material.
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申请公布号 |
US2002074638(A1) |
申请公布日期 |
2002.06.20 |
申请号 |
US20010788703 |
申请日期 |
2001.02.20 |
申请人 |
LIAO KUANG-HO;LIN FENG;CHEN YUN-SHENG |
发明人 |
LIAO KUANG-HO;LIN FENG;CHEN YUN-SHENG |
分类号 |
H01L23/495;(IPC1-7):H01L23/34;H01L21/00;H01L23/02 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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