| 摘要 |
PURPOSE: A double band type surface acoustic wave filter and a method for fabricating the same are provided to reduce a chip size by forming two surface acoustic wave filters with one bare chip. CONSTITUTION: The first RF surface acoustic wave filter and the second RF surface acoustic wave filter are formed with one bare chip(10). The first RF surface acoustic wave filter has the first frequency pass band. The second RF surface acoustic wave filter has the second frequency pass band. The bare chip(10) is mounted in a ground part(12) of a package(11) by using a die bonding method. A double band type surface acoustic wave filter is formed by performing sequentially a wire bonding process, a welding process, and a laser marking process. The wire bonding process for the bare chip(10) is performed by using two wires(13a,13b). An inside of the package(11) is closed by a cover(14). An electrode portion(15) performs a signal transfer function for transferring a signal to the first RF surface acoustic wave filter and the second RF surface acoustic wave filter. |
