| 摘要 |
PURPOSE: A method for fabricating a memory module is provided to reduce contact resistance between a heat sink and a package, by improving step coverage of the packages. CONSTITUTION: The heat sink(14) is attached to the memory module. An adhesive material is applied on a surface of the heat sink. The upper surface of the packages(12) is attached to the upper portion of the adhesive material while a predetermined portion of the upper portion of the packages is separated. A printed circuit is mounted on the lower surface of the packages.
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