| 摘要 |
The present invention provides a three-dimensional chip assembly and the corresponding methods for producing such an assembly. The present invention utilizes flip chip technology, i.e., using solder balls to directly connect the chip to the substrate, to create chip assemblies that can be arranged in horizontal arrays of varying geometries as well as being stacked at chosen points in such arrays to produce a three dimensional array or assembly of semiconductor chips. Since the designer can specify the geometry of the arrays, this invention allows the creation of customized three-dimensional chip assemblies that maximize the internal space utilization of the devices that they are integrated into. |
