| 发明名称 |
Seed layer recovery |
| 摘要 |
Disclosed is a method for repairing of seed layers by removal of oxidized metal from the seed layers prior to subsequent metallization. Also disclosed is a method for monitoring such repair to provide substantially metal oxide free seed layers.
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| 申请公布号 |
US2002074242(A1) |
申请公布日期 |
2002.06.20 |
| 申请号 |
US20010977596 |
申请日期 |
2001.10.13 |
| 申请人 |
SHIPLEY COMPANY, L.L.C. |
发明人 |
MORRISSEY DENIS;CALVERT JEFFREY M.;BEICA ROZALIA |
| 分类号 |
C25D7/12;H01L21/288;H01L21/768;(IPC1-7):C25F5/00;C25F1/00;C30B30/02 |
主分类号 |
C25D7/12 |
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