发明名称 METHOD FOR FIXING THE SUBSTRATE OF AN ACOUSTIC TRANSDUCER
摘要 The invention relates to a method in connection with an acoustic transducer, such as a microphone (1), for a communication device, such as a wireless communication device (4), in which method the acoustic transducer (1) is attached on a substrate (2), such as a circuit board, or integrated in the substrate (2), and the housing (5) of the communication device is formed of at least a first (5a) and a second part (5b). The substrate (2) is provided with one or more apertures (3a-3f), which partly surround the acoustic transducer (1) order to achieve a nearly floating attachment for the acoustic transducer (1).
申请公布号 US2002076041(A1) 申请公布日期 2002.06.20
申请号 US19990412740 申请日期 1999.10.04
申请人 HIETANEN JARMO 发明人 HIETANEN JARMO
分类号 H04R1/02;G10K11/00;H04M1/02;H04M1/03;H04R19/04;H05K1/02;(IPC1-7):H04M1/00;H04M9/00 主分类号 H04R1/02
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