| 摘要 |
The present invention relates to a method and system for full parametric testing of the drive and receive capability of bi-directional driver/receiver-stages, and in particular of bi-directional input/output-stages of a semiconductor chip. Electrical properties, as for example DC-resistance, AC-impedance of a driver stage are tested by at least one test load implemented on the chip itself which causes a characteristic voltage drop usable for test evaluation. Advantageously, the output stage devices of P-type(50, 52) and N-type(54,56), respectively, are split into at least two sub-devices P1, P2 and N1, N2, and are controlled separately by a control logic (60,62,64,70,72,74). Then, for example N2 is used for testing the P device, and P2 is used for testing the N-device. Thus, devices already present on the chip are re-used for test purposes, which makes off-chip testing unnecessary.
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