| 摘要 |
<p>The present invention features a packaging system (100) for two-dimensional optoelectronic arrays (185). In one embodiment, the packaging includes a heat spreader (120), a housing (105) with embedded electrical interconnections, a substrate including electrical contacts, an application specific integrated circuit (ASIC) (150) including a hybridized array with vertical cavity surface emitting laser (VCSEL) (185), detectors or both. The waveguide assembly (190) includes a plurality of individual one-dimensional waveguides formed in waveguide sheets (230a-230d), wherein the waveguides match the array footprint on one end and a connector footprint on the other end.</p> |
