发明名称 |
Etchant and method for fabricating a substrate for an electronic device using the same |
摘要 |
An etchant and a method for fabricating a substrate for an electronic device using the etchant where the etchant contains a predetermined additive to control the etch rate of a Cu deposition layer (containing Cu, Cu/Ti, or Cu/Ta) over passage of time. Some examples of the additive may include a chelate having the -COOH group, a chemical compound containing a Cu ion, and a deoxidizer containing sulfur (S). The method includes forming a metal thin film containing copper (Cu) on a substrate, selectively exposing the metal thin film, and etching at least one of the exposed and the unexposed portions on the metal thin film with the additive-containing etchant to control the Cu etch rate over time against the number of sheets of processed substrates. The use of the additive-containing etchant results in improved yield and reduction in production costs because of less frequent etchant replacements.
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申请公布号 |
US2002076930(A1) |
申请公布日期 |
2002.06.20 |
申请号 |
US20010983733 |
申请日期 |
2001.10.25 |
申请人 |
LG. PHILIPS LCD CO., LTD. |
发明人 |
JO GYOO CHUL;CHAE GEE SUNG |
分类号 |
G02F1/13;C23F1/18;G02F1/1368;H01L21/28;H01L21/302;H01L21/306;H01L21/308;H01L21/3205;H01L21/3213;H01L21/336;H01L21/461;H01L21/77;H01L23/52;H01L29/786;(IPC1-7):H01L21/302 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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