| 摘要 |
PURPOSE: To suppress occurrence of cracks when a thinned semiconductor element is peeled off from an adhesive sheet. CONSTITUTION: A first prick-up pin group 24a and a second prick-up pin group 24b are mounted to a pin holder 23. The first prick-up pin groups 24a are disposed corresponding to each corner part of a semiconductor element 1, respectively, and the second prick-up pin groups 24b are disposed corresponding to near a center part of the semiconductor element 1 and a front end thereof is lower than that of the first prick-up pin group 24a. After each corner part of the semiconductor element 1 is peeled off from the first prick-up pin group 24a, the vicinity of the center part of the semiconductor element 1 is peeled off by the second prick-up pin group 24b. A stress is concentrated on the front end of a prick-up pin, thereby preventing from penetrating the semiconductor element, and when it is pricked up by the first prick-up pin group, even if the vicinity of the center part of the semiconductor element is curved, it is held by pricking-up of a second prick-up pin. As a result, it is possible to suppress cracks caused by a curve of the semiconductor element. |
