| 摘要 |
A sheet including lead regions with conductors and a main region surrounding the lead regions is formed on the front surface of a microelectronic element such as a wafer, or assembled thereto, so that the conductors are connected to contacts on the microelectronic element. After the sheet is in place, the sheet is eroded to form gaps partially bounding the lead regions, leaving tip ends of the lead regions moveable with respect to the main region. The tip ends of the lead regions, or the main region, is lifted away from the microelectronic element, thus bending the tip ends away from the main region. Because the gaps are not formed until after the conductors are connected to the contacts, the connecting step is simplified.
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