发明名称 |
Liquid crystalline polymer bond plies and circuits formed therefrom |
摘要 |
A multi-layer circuit board comprises a liquid crystalline polymer bond ply disposed between two circuit layers wherein the liquid crystalline polymer bond ply is formed by treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply with an in-plane coefficient of thermal expansion (CTE) of 0 to about 50 ppm/° C. and further wherein the multi-layer circuit is formed by lamination at a temperature of 0° C. to about 10° C. less than the melt temperature of the liquid crystalline polymer.
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申请公布号 |
US2002076538(A1) |
申请公布日期 |
2002.06.20 |
申请号 |
US20010006990 |
申请日期 |
2001.12.04 |
申请人 |
ST. LAWRENCE MICHAEL E.;KENNEDY SCOTT |
发明人 |
ST. LAWRENCE MICHAEL E.;KENNEDY SCOTT |
分类号 |
B32B15/08;H05K3/46;(IPC1-7):B32B3/00 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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