发明名称 Method for forming thick film pattern and photosensitive paste used therefor
摘要 A method for forming a thick film pattern is provided which can easily perform pattern formation even when a photosensitive paste containing a powdered conductor at a high content and having a low optical transmittance is used and which can form a thick film pattern having a rectangular cross-section and superior high-frequency transmission characteristics. In addition, a photosensitive paste used therefor is also provided. The thick film pattern having a predetermined shape can be formed by the steps of determining the photocurable depth d of a photosensitive paste; coating with the photosensitive paste in consideration of the photocurable depth d so as to form a photosensitive paste film having a predetermined thickness t; exposing the photosensitive paste film; and developing the exposed photosensitive paste film. Preferably, the coating with the photosensitive paste is performed so that the relationship between the photocurable depth d of the photosensitive paste and the thickness t of the photosensitive paste film satisfies the equation t<=d.
申请公布号 US2002076657(A1) 申请公布日期 2002.06.20
申请号 US20010897305 申请日期 2001.07.02
申请人 MURATA MANUFACTURING CO., LTD. 发明人 TOWATA SHUICHI
分类号 B32B27/30;G03F7/004;G03F7/027;G03F7/16;G03F7/26;G03F7/38;H05K1/09;H05K3/02;(IPC1-7):G03F7/00;B32B9/00 主分类号 B32B27/30
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