发明名称 |
LIQUID CRYSTALLINE POLYMER BOND PLIES AND CIRCUITS FORMED THEREFROM |
摘要 |
A multi-layer circuit board (10) comprises a liquid crystalline polymer bond ply (12) disposed between two circuit layers (14, 20) wherein the liquid crystalline polymer bond ply (12) is formed by treating a film comprising a liquid crystalline polymer with an amount of heat and pressure effective to produce a liquid crystalline polymer bond ply (12) with an in-plane coefficient of thermal expansion (CTE) of 0 to about 50 ppm/°C and further wherein the multi-layer circuit (10) is formed by lamination at a temperature of 0°C to about 10°C less than the melt temperature of the liquid crystalline polymer. |
申请公布号 |
WO0249404(A2) |
申请公布日期 |
2002.06.20 |
申请号 |
WO2001US46671 |
申请日期 |
2001.12.04 |
申请人 |
WORLD PROPERTIES INC. |
发明人 |
ST. LAWRENCE, MICHAEL, E.;KENNEDY, SCOTT |
分类号 |
B32B15/08;H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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