发明名称 Form-in-place EMI gaskets
摘要 A form in place conductive gasket is disclosed. The gasket, foamed, gelled or unfoamed is made of one or more elastomer resins, such as silicone urethane and/or thermoplastic block copolymers and is either filled with a conductive filler and lined onto a desired substrate or lined onto the substrate unfilled and then coated with a conductive utrelayer, such as a silver filled elastomer or a conductive flocked layer. A process and system for making the gaskets are also disclosed.
申请公布号 US2002076547(A1) 申请公布日期 2002.06.20
申请号 US20010970159 申请日期 2001.10.02
申请人 发明人 KALINOSKI JOHN P.;BUNYAN MICHAEL H.
分类号 B65D81/30;B65D53/06;F16J15/06;F16J15/14;H01Q17/00;H05K9/00;(IPC1-7):B32B5/16 主分类号 B65D81/30
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