发明名称 Method for manufacturing semiconductor device
摘要 Providing a method for manufacturing a semiconductor device, with which it is possible to maintain an isolation breakdown voltage of a LOCOS isolation area high in a semiconductor device finely integrated. A method for manufacturing a semiconductor device, in which a source/drain region is formed by ion implantation on a silicon substrate isolated by a LOCOS isolation area, further comprises a mask forming step to form an implantation mask on the LOCOS isolation area. An implantation mask is formed so as to prevent ions implanted at an ion implantation step from passing through the LOCOS isolation area and arriving at the silicon substrate below the LOCOS isolation area.
申请公布号 US2002076888(A1) 申请公布日期 2002.06.20
申请号 US20010931098 申请日期 2001.08.17
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 SHIROMOTO TATSUYA;SHIMIZU SATOSHI
分类号 H01L21/8247;H01L21/762;H01L21/8234;H01L27/08;H01L27/088;H01L27/10;H01L27/115;H01L29/788;H01L29/792;(IPC1-7):H01L21/336 主分类号 H01L21/8247
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