An integrated circuit comprises an inductor path (17) formed in a metal layer located in a surface structure on top of an electrically well conducting substrate (7). Trenches (1) filled with an electrically isolating material are located under the inductor path and are arranged in a meshlike or grid pattern. In order to improve the shielding of the inductor path and to simultaneously improve the Q-value of the inductor, in the islands (5) of material formed in the surface structure between the meshes of the pattern deep substrate contacts (11) are located. The substrate contacts extend down into the substrate and the substrate and the contacts are intended to be connected to ground potential. Electrically conducting areas (13) can cover the islands and are then connected to the substrate contacts.
申请公布号
WO0249110(A1)
申请公布日期
2002.06.20
申请号
WO2001SE02768
申请日期
2001.12.13
申请人
TELEFONAKTIEBOLAGET L M ERICSSON (PUBL);JOHANSSON, TED;NORSTROEM, HANS;CARLSSON, MATS