发明名称 FORM-IN-PLACE GASKET FOR ELECTRONIC APPLICATIONS
摘要 <p>A non-silicone, form-in-place gasket produced using automated placement followed by curing of a pattern of an extrudable thixotropic material comprising a liquid polyolefin oligomer a reactive diluent a thixotropic filler and a curative. The form-in-place gasket, after curing, has a compression set of 7 % to about 20 %, a level of outgassing components of about 10 νg/g to 45 νg/g and a Shore A hardness from 45 to 65.</p>
申请公布号 WO2002048584(A1) 申请公布日期 2002.06.20
申请号 US2001009941 申请日期 2001.03.27
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