| 摘要 |
A heat curable thermosetting epoxy resin formulation useful for making prepregs and electrical laminates containing a viscosity modifier, wherein the viscosity modifier is: (a) an optionally substituted polymer of a monovinylidene aromatic monomer, optionally having one or more further unsaturated monomers copolymerized therewith; (b) an optionally substituted polyphenylene oxide; or (c) an oxazolidone ring-containing compound.
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