LIGHT EMITTING SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A method for fabricating a light emitting semiconductor device is provided to improve light emitting efficiency and light receiving efficiency, by forming resin in the lower portion of penetrating epoxy resin wherein a filler of high heat radiation is inserted into the resin. CONSTITUTION: A pair of frames are made of a plurality of columns and are dotted in every single lead frame by using conductive adhesive. A light emitting semiconductor chip is bonded to the conductive adhesive. The light emitting semiconductor chip is bonded to the frame part of the lead frame by using a conductive wire. Penetrating epoxy rein is potted to a mold cup of a receptacle type in every constitution element of a package. The lead frame is inserted into the mold cup and is precured. Heat radiation epoxy resin is potted to the mold cup of the receptacle type in every constitution element of the package and is cured.