| 发明名称 |
Bump chip lead frame and package |
| 摘要 |
A lead frame with a plurality of bump terminals is provided. Stamping an indentation into each lead in the lead frame forms the bump terminals. The bump terminals will be used as contact points in a completed semiconductor device.
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| 申请公布号 |
US2002074147(A1) |
申请公布日期 |
2002.06.20 |
| 申请号 |
US20000736462 |
申请日期 |
2000.12.15 |
| 申请人 |
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC |
发明人 |
TAN AIK CHONG;TAN CHONG UN;CHEW CHEE CHUAN |
| 分类号 |
H01L21/48;H01L23/31;H01L23/495;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/48 |
| 代理机构 |
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