| 摘要 |
In a temperature compensation apparatus for thermally loaded bodies made from materials of low specific thermal conductivity, a heat-distributing device having one or more heat-distributing bodies is adapted to surfaces of the thermally loaded body such that there remains between the thermally loaded body and the heat-distributing bodies a gap which is filled with a fluid for the purpose of the thermal coupling of thermally loaded bodies and heat-distributing bodies in conjunction with mechanical decoupling.
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