发明名称 |
Electronic component and method of manufacturing the same |
摘要 |
An electronic component having a substrate on which one or more grooves are formed on its opposing side faces; electrodes formed on the groove and top and bottom faces of the substrate at a portion adjacent to the groove; and a circuit element formed between the electrodes. An electrode is also formed on the opposing side faces of said substrate at a portion other than the grooves. This structure enables to improve the reliability of a soldered portion even for small electronic components with about 10 mum thick electrodes such as chip resistors, chip capacitors, and chip inductors.
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申请公布号 |
US2002076536(A1) |
申请公布日期 |
2002.06.20 |
申请号 |
US20010917313 |
申请日期 |
2001.07.27 |
申请人 |
YAMADA HIROYUKI;ISEKI TAKESHI;KINOSHITA YASUHARU |
发明人 |
YAMADA HIROYUKI;ISEKI TAKESHI;KINOSHITA YASUHARU |
分类号 |
H01C17/28;H01C1/01;H01C7/00;H01F27/29;H01G2/06;H01L23/12;H01L23/13;H01L23/498;H05K1/18;H05K3/34;(IPC1-7):B32B3/00 |
主分类号 |
H01C17/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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