发明名称 |
Multi-layer circuits and methods of manufacture thereof |
摘要 |
A multi-layer circuit comprises a circuit and a resin covered conductive layer disposed on the circuit, wherein the resin covered conductive layer comprises a liquid crystalline polymer resin laminated to a conductive layer. Such multi-layer circuits are particularly useful for high density circuit applications.
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申请公布号 |
US2002074158(A1) |
申请公布日期 |
2002.06.20 |
申请号 |
US20010020590 |
申请日期 |
2001.12.13 |
申请人 |
ST. LAWRENCE MICHAEL E.;KENNEDY SCOTT D. |
发明人 |
ST. LAWRENCE MICHAEL E.;KENNEDY SCOTT D. |
分类号 |
B32B15/08;H05K3/46;(IPC1-7):B32B15/00 |
主分类号 |
B32B15/08 |
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地址 |
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