| 摘要 |
A process for producing a thermoformed package comprises the steps of placing a first sheet of film over a forming die having at least one cavity; heating the film to mould the film into the at least one cavity thereby forming at least one recess in the film, placing a composition in the at least one formed recess and sealing a second sheet of film across the at least one formed recess to produce at least one closed package. Each cavity includes a curved edge at least a portion of which comprises a resiliently deformable material. |
