| 摘要 |
A plurality of wafers (23) are held and spaced parallel and can be loaded/unloaded through the front of a carrier. Protrusions (49) having arcuate inner peripheral parts (47) are provided to teeth (30) which are formed on the inner wall of a wafer carrier (21) and which hold the peripheral part of each wafer from the left and right sides. Thereby, wafers are symmetrically held on the back and front sides. As a consequence, when thin wafers are accommodated, downward warp of the wafers is reduced and the work of loading/unloading of a wafer is easy. Each protrusion has a discrete shape in vertical cross section to prevent interference with a wafer being loading/unloading. The size F of the flat part of each valley part of the waving shape in the vertical cross section of the teeth is large so as to increase the size of the pickup area for picking up a wafer.
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