发明名称 |
MICROELECTRONIC PACKAGE HAVING BUMPLESS LAMINATED INTERCONNECTION LAYER |
摘要 |
A microelectronic device fabrication technology that places at least one microelectronic die within at least one opening in a microelectronic package core and secures the microelectronic die/dice within the openings(s) with an encapsulation material, that encapsulates at least one microelectronic die within an encapsulation material without a microelectronic package core, or that secures at least one microelectronic die within at least one opening in a heat spreader. A laminated interconnector of dieelectric materials and conductive traces is then attached to the microelectronic die/dice and at least one of following: the encapsulation material, the microelectronic package core, and the heat spreader, to form a microelectronic device. |
申请公布号 |
WO0249103(A2) |
申请公布日期 |
2002.06.20 |
申请号 |
WO2001US44968 |
申请日期 |
2001.11.15 |
申请人 |
INTEL CORPORATION;WERMER, PAUL, H.;TOWLE, STEVEN, N. |
发明人 |
WERMER, PAUL, H.;TOWLE, STEVEN, N. |
分类号 |
H01L23/12;H01L21/56;H01L21/68;H01L23/538;H05K1/18;H05K3/46 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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