METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD HAVING HIGH FREQUENCY AND BASE BAND CIRCUITS

摘要

PURPOSE: A method for manufacturing a printed circuit board having a high frequency circuit and a base band circuit is provided to minimize an EMI by reducing a size of a current path loop. CONSTITUTION: A ground pattern(21) for a high frequency circuit and a ground pattern(22) for a base band circuit are separately formed. A high frequency circuit to a base band circuit are formed at a circuit forming layer. A signal line connects the high frequency circuit to the base band circuit. The ground pattern(21) for a high frequency circuit and the ground pattern(22) for a base band circuit are connected to each other at a location away from the signal line. The ground pattern(21) for a high frequency circuit and the ground pattern(22) for a base band circuit are connected to each other by means of a capacitor at a location near to the signal line.