| 摘要 |
PURPOSE: An area array bumped semiconductor package having a ground and power line is provided to effectively use the inner space of the semiconductor package by locating the ground and power line inside leads. CONSTITUTION: A plurality of bonding pads are formed on the center portion of the rear surface of a semiconductor chip(31). The lower portion of the semiconductor chip(31) is supported by a plurality of leads(32) having a protrusion part, wherein the protrusion part is arranged on the lower portion of the lead(32). A ground and power line(33) are formed inside the leads(32). The semiconductor chip(31) is attached to the upper portion of the leads, and the ground and power line(33) is attached to the rear surface of the semiconductor chip(31) using an adhesive(34). The semiconductor chip(31), the leads(32), and the ground and power line(33) are electrically connected to each other by using wires(35). A molding part(36) is formed on the resultant structure so as to protect the resultant structure and to simultaneously expose the protrusion part to the outside through the lower surface of the resultant structure. |
