发明名称 |
PHOTOELECTRIC WIRING BOARD, PACKAGING BOARD, AND PHOTOELECTRIC WIRING BOARD PRODUCING METHOD |
摘要 |
Disclosed is an optical-electrical wiring board (10), comprising an electrical wiring board (11) having a through-hole formed therein and an optical wiring layer (12) laminated on the board (11) and including a core (120) and a clad (121) surrounding the core (120). The electrical wiring board (11) includes an electrical wiring formed on one surface of the board (11) and pads (15, 17) on which optical parts are mounted. The pads (15, 17) are electrically connected to the electrical wiring and arranged on one surface of the electrical wiring board (11) in the vicinity of a through-hole. The core (120) includes a horizontal waveguide (120a) for propagating the light beam in a horizontal direction along the electric wiring board (11) and a vertical waveguide having a part arranged inside the through-hole and crossing the horizontal waveguide (120a). The vertical waveguide propagates the light beam in a direction perpendicular to the electric wiring board (11). |
申请公布号 |
EP1215514(A1) |
申请公布日期 |
2002.06.19 |
申请号 |
EP20000940832 |
申请日期 |
2000.06.26 |
申请人 |
TOPPAN PRINTING CO., LTD. |
发明人 |
TSUKAMOTO, TAKEHITO;YOSHIDA, MASAKICHI;MINATO, TAKAO |
分类号 |
G02B6/138;G02B6/42;G02B6/43;H05K1/02 |
主分类号 |
G02B6/138 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|