| 发明名称 |
Method of forming bump electrodes |
| 摘要 |
<p>A method of forming a plurality of bump electrodes en bloc on a bump electrode formation surface of a wafer from which chips are to be separated, or on an upper surface of a plurality of chips which are separated from a wafer and placed side by side, the upper surface constituting a bump electrode formation surface, is disclosed. <IMAGE> <IMAGE> <IMAGE></p> |
| 申请公布号 |
EP0932193(A3) |
申请公布日期 |
2002.06.19 |
| 申请号 |
EP19990101055 |
申请日期 |
1999.01.22 |
| 申请人 |
RICOH MICROELECTRONICS CO., LTD. |
发明人 |
KINOSHITA, MAKOTO |
| 分类号 |
H01L21/60;H01L23/485;H05K3/12;H05K3/20;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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