发明名称 |
ELECTRODE CONTACT APPARATUS FOR GILDING LEAD FRAME |
摘要 |
PURPOSE: An electrode contact apparatus for gilding lead frame is provided to improve the gilding efficiency by maximizing a current and to prevent the deviation of a lead frame by supporting the lead frame with a pair of rollers. CONSTITUTION: An electrode shaft(24) capable of circulating is installed between an upper mounting frame(21) and a lower fixing frame(22). An upper disc(25) and a lower disc(26) are respectively fixed on the upper mounting frame(21) and the lower fixing frame(22) using bolts(38). At this time, the upper and lower discs(25,26) are contacted each other, thereby increasing a current through the discs(25,26). A first and a second roller(29,30) having cylindrical shape are respectively contacted with the upper and lower discs(25,26) so as to stably transfer a lead frame.
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申请公布号 |
KR20020045019(A) |
申请公布日期 |
2002.06.19 |
申请号 |
KR20000074307 |
申请日期 |
2000.12.07 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
KIM, JONG SIK;LEE, SANG HUN;PARK, SE CHEOL |
分类号 |
H01L21/50;(IPC1-7):H01L21/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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