| 摘要 |
PURPOSE: A cleaning method of a wafer is provided to simplify the cleaning processes by removing AMCs(Air Molecular Contaminants) using ozone. CONSTITUTION: A wafer(80) is dipped into a cleaning equipment so as to remove AMCs on the wafer. The cleaning equipment comprises a process container(60) for containing ozone, a container diffusion unit(50), and an ozone generator(20) for supplying ozone into the process container(60). At this time, an ozone water are generated by using a polymer solvent having a high solubility, wherein the polymer solvent is selected from the groups consisting of CH3COOH, C2H5COOH, CCl, and CHCl2CHCl2.
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