| 摘要 |
PURPOSE: An area array bumped semiconductor package with chips is provided to be capable of arranging lead protrusion arrays on the lower surface of the area array bumped semiconductor package and organically connecting the built-in chips with leads. CONSTITUTION: A plurality of bonding pads are formed on the upper portions of semiconductor chips(31,32). The semiconductor chips(31,32) are supported with a pair of lead arrays formed with leads(33). The leads(33) include a protrusion part, respectively, wherein protrusion part are arranged on the lower portions of the leads(33). The semiconductor chips(31,32) are attached to the upper portions of the lead arrays using an adhesive(34). The semiconductor chips(31,32) are electrically connected with the leads(33) of the lead arrays using wires(35), independently and mutual-crosswise. A molding part(36) is formed on the resultant structure so as to protect the resultant structure and to simultaneously expose the protrusion part to the outside through the lower surface of the resultant structure.
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