| 摘要 |
PURPOSE: A pattern measuring method for manufacturing a semiconductor device is provided to reduce a measuring time by minimizing the number of rounding of a substrate when measuring an overlay pattern. CONSTITUTION: Measuring points(210a) included to an overlay pattern of a first portion(210) in the middle of a plurality of overlay pattern portions(210,220,230,240,250) are completely measured so as to check aligns of layers sequentially formed on a substrate(200). After measuring the first portion(210), another measuring points(220a) of a second overlay pattern portion(220) are also completely measured. Then, the measuring step is repeated until completely measuring the measuring points(230a,240a,250a), thereby reducing the number of rounding of the substrate(200). At this point, the overlay pattern portions(210,220,230,240,250) are formed on the center and the edges of the substrate(200) and the measuring points(210a,220a,230a,240a,250a) are respectively formed on the center and the edges of the overlay pattern portions(210,220,230,240,250).
|
