发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PURPOSE: To realize a wiring structure which is capable of cutting down signal delays in a semiconductor device without increasing manufacturing processes in number. CONSTITUTION: A semiconductor device is equipped with a plurality of functional blocks. Wirings provided to the semiconductor device are divided into those belonging to the functional regions and those belonging to inter-functional block regions, and normal multilayer interconnections are provided to the functional blocks. A transmission line or a coaxial line is provided to the inter-functional block regions at the same time so as to realize the above target wiring structure without increasing manufacturing processes in number.
申请公布号 KR20020045522(A) 申请公布日期 2002.06.19
申请号 KR20010072622 申请日期 2001.11.21
申请人 SHARP CORPORATION 发明人 AWAYA NOBUYOSHI
分类号 H01L23/52;H01L21/3205;H01L21/768;H01L21/82;H01L23/522;(IPC1-7):H01L21/768 主分类号 H01L23/52
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