POLISHING PAD CONDITIONER OF POLISHING APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A polishing pad conditioner of a polishing apparatus for manufacturing a semiconductor device is provided to prevent a partial abrasion of a polishing pad by performing an equal conditioning of the polishing pad through the optimization of the polishing pad conditioner. CONSTITUTION: A polishing pad conditioner comprises a bladder(26) connected with diamond pellet having an inner space(26a) injected with air, a conditioner arm(22) fixed on the bladder(26) for supporting the bladder(26), and a mount keeping a distance with the upper portion of the conditioner arm(22) for supporting the conditioner arm(22) by connecting to the center of the conditioner arm(22). The conditioner arm(22) further includes nozzles(30) fixed in the conditioner arm(22) as one body for supplying cleansing solution to the polishing pad, thereby preventing a warpage of the conditioner arm(22) due to a clash between the conditioner arm(22) and the nozzles(30) so as to equally perform the conditioning of the polishing pad.